HANMI Semiconductor has developed post-processing equipment specialized for semiconductor packages for vehicles. It is a stepping stone to aggressively target the automotive semiconductor market, when supply and demand of semiconductors is intensifying. They will accelerate market penetration by diversifying their product portfolio.
HANMI Semiconductor announced on the 17th that it has released a 'tape micro SAW' that cuts semiconductor packages for vehicles. Equipment began to be supplied to global semiconductor customers.
The tape micro saw is a post-processing equipment that attaches semiconductor packages to tapesand cuts (saws) them. Tape fixing technology was added while fixing the wafer and package in a vacuum. It is suitable for cutting power semiconductors and sensor packages where moisture contact must be minimized. It is also useful for cutting through thick automotive semiconductors with a large package size. It can also be used for general semiconductor packages.
HANMI Semiconductor improved their package productivity by 40%, compared to their competitors' products, by applying dual chucks. The package cutting speed was greatly increased thanks to the fully-automatic system, rather than the semi-automatic method. It is also characterized by enhanced precision cutting and customer convenience functions.
HANMI Semiconductor predicts that customer demand to replace existing manual equipment will be high. Dong-shinKwak, CEO(Vice Chairman)of HANMI Semiconductor, said, “The equipment will be put into the global vehicle semiconductor production line," and "Demand for tape microSAW equipment will increase due to the unprecedented shortage of semiconductors for vehicles.".
After launching the first 'dual chuck micro saw' in June last year, HANMI Semiconductor also launched a '20-inch micro saw for jumbo PCB' in October, capable of cutting next-generation semiconductor 'Flip Chip Ball Grid Array (FC-BGA)' packages. At the end of last year, the company introduced a 12-inch micro saw, and now has successfully developed their tape micro SAW, securing a portfolio of 4 types of micro saw products. Their strategy is to target new markets by diversifying their product lines. They are now able to quickly respond to the high-tech semiconductor package market, where demand is rapidly increasing.
HANMI Semiconductor decided to split their stocks in order to ease the daily stock price fluctuationsand expand the number of shares in circulation toimprove transaction accessibility for general shareholders. They will split its stock value from 200 won to 100 won per share, and list new shares on the 6th of next month. It will also strengthen its shareholder return policy by pushing for cash dividends of 600 won per share in last year's settlement, the highest performance since its foundation.
By Staff Reporter Dong-joon Kwondjkwon@etnews.com