Duk San Hi Metal, Hanyang University, and the University of Maryland joined hands to secure semiconductor packaging material technology. It will provide development funds, and join forces with Hanyang University and the University of Maryland to develop next-generation semiconductor packaging materials and technical personnel.
On the 26th, Duk San Hi Metal signed an MOU for joint venture of semiconductor packaging materials with Hanyang University and the University of Maryland at Hanyang University’s Seoul Campus.
Duk San Group Vice Chairman Soo-hoon Lee, Duk San Hi Metal President Geum-sul Oh, Hanyang University President Woo-seung Kim, Director of Hanyang Advanced Semiconductor Packaging Center Hak-seong Kim, Hanyang Smart Vice President of Semiconductor Research Institute Jin-ho Ahn, and University of Maryland Professor Bong-tae Han attended the ceremony.
For the next three years, Duk San Hi Metal, Hanyang Advanced Semiconductor Packaging Center, and the University of Maryland will start developing semiconductor packaging materials and technical personnel. Duk San Hi Metal plans to invest hundreds of thousands of dollars in related development. Hanyang University is the first university in Korea to establish the Advanced Semiconductor Packaging Center.
This industry-university cooperation is a new attempt to respond to the growth of the advanced semiconductor packaging market. The third party will establish a value chain in all fields of material, human resources, and infrastructure development at the Hanyang Semiconductor Packaging Center. The packaging center establishes a computer simulation evaluation system for the development of semiconductor solder materials. It also operates a joint program to nurture specialists in semiconductor packaging materials.
Duk San Hi Metal is a manufacturer for semiconductor packaging materials. It supplies solder ball materials to Samsung Electronics, SK Hynix, and its packaging partners. Solder balls are materials that connect semiconductor chips and substrates that transmit electrical signals. Solder balls are under the spotlight as key materials for improving the electrical performance of semiconductors. Solder balls are used in FC-BGA of Intel, AMD, and Nvidia such as GPUs CPUs.
Duk San Hi Metal has not only produced solder materials domestically, but also produced micro-solder balls (MSB) that was led by Japan, and ranked first in the global market share. It is strengthening technology exchange and product development in response to the demand for high-performance semiconductors such as artificial intelligence (AI), high-performance computing, and data centers.
The development of advanced packaging materials will also be enhanced. Duk San Hi Metal creates a competitive ecosystem for semiconductor packages, and reduces the size of solder balls or develops package materials that apply new metal materials.
Hanyang University provides the packaging center material performance verification infrastructure to develop new 2.5-dimensional (2.5D) and 3-dimensional (3D) package materials for Duk San Hi Metal. The University of Maryland aids Duk San Hi Metal’s development of next-generation semiconductor materials by providing technological exchanges. The company will accelerate the development of advanced packaging material products.
Duk San Group Vice Chairman Soo-hoon Lee said, “We will strive to develop advanced packaging-related technologies and future materials through international cooperation for semiconductor packaging between Korea and the US and collective convergence research. Duk san Hi Metal will take the lead in improving the competitiveness of the semiconductor packaging industry in Korea.”
By Staff Reporter Ji-woong Kim (jw0316@etnews.com)