DB HiTek produces semiconductor chips by making a thin film made with gallium nitride (GaN) material on a silicon wafer. This technology responds to rapidly growing markets such as communication devices, electric vehicle chargers, and solar converters.
DB HiTek is going to produce 8-inch semiconductors based on new semiconductor wafer deposition technology (Gan-On-Si). It is a technology that deposits GaN material thin films on silicon wafers with ‘Gallium Nitride-On-Silicon’ (GaN-On-Si) technology. GaN is a next-generation semiconductor material that improves power efficiency in communication devices, electric vehicle fast chargers, and solar converters.
DB HiTek is a company specializing in 8-inch foundry. The company is also trying to respond to the 8-inch semiconductor market by introducing GaN-On-Si deposition technology into the foundry process.
When GaN-On-Si is applied, it is expected that wafer processing will be easy and profitability can be strengthened by increasing competitiveness in semiconductor manufacturing as it is advantageous for GaN deposition on silicon wafers.
GaN-On-Si is the first technology applied by Taiwan's TSMC to a 6-inch foundry in the foundry industry. TSMC will work with ST Micro to secure 6-inch semiconductor production technology in 2020 and commercialize next-generation semiconductors in the new year.
Taiwan's TSMC and Vanguard are also expected to apply GaN-On-Si technology to Taiwan's foundry.
DB HiTek is expected to respond to the 8-inch market by utilizing its Chungbuk plant this year. It plans to respond to demands for 8-inch semiconductors such as electric vehicles and electric devices by making the most of the Sangwoo fab in Chungbuk or making additional investments.
An official from DB HiTek said, "Next-generation material-based semiconductors will respond to customer demand until the supply chain (SCM) is equipped as a promising market."
By Staff Reporter Ji-woong Kim (jw0316@etnews.com)