Fabless (semiconductor manufacturing) company Raon Tech has developed Augmented Reality·Virtual Reality (AR·VR) key components and will be releasing them in the later half of the year.
Raon Tech is producing the HD resolution level ‘micro display’ that is key component to AR ·VR device. Japan’s Sony, Taiwan display chip manufacturing company HIMAX have tried to develop such components but it is first for a domestic brand.
The micro display that Raon Tech has realized uses silicon semiconductor wafer. LCD that is used on Smartphone117 or OLED176 is too small to realize high resolution. Normal semiconductor chip is 1~2mm big. The chip that is used on micro display is 1cm wide and 2cm long.
Raon Tech has applied a special processing different from normal semiconductor processing called ‘Liquid Crystal on Silicon (LCoS) method’ on the micro display. They have cut the wafer and put up special mirror and screen.
Raon Tech is digital and analog radio frequency (RF) tech company that specializes in DBM chip business. They have been developing micro display for the past 4 years. They are expected to expand their market through scheduled release of AR·VR device in the later half of the year.
President Boeun Kim said, “We have finished preparation for mass production. The device with Raon Tech component will first be revealed oversea. We are planning to release full HD level product soon so that customers may enjoy virtual reality in a big and clear display.”
Staff Reporter Bae, Okjin | withok@etnews.com