LX Semicon, Korea's leading semiconductor design fabless company, will develop 3D sensing solution in cooperation with Microsoft (MS).
LX Semicon and Microsoft announced on the 8ththat they have recently signed a business agreement to develop a solution based on MS 3D time-of-flight (ToF) sensing technology.
ToF is a technology that calculates the distance by precisely measuring the time the light source is reflected off the subject and returns. When combined with a camera, it can express objects in 3D. ToF has been attracting attention as a core technology that can quickly and accurately recognize space in devices such as virtual reality (VR), augmented reality (AR), and mixed reality (MR). Major smartphone manufacturers, including Apple, are installing ToF on mobile devices, and ToFs are also recently used in various industries such as automobiles and logistics.
MS 3D sensing technology has proven its excellence as it has been applied to various MS products such as 'Kinect' in the game sector, 'HoloLens' in mixed reality, and 'Azure Kinect'.
LX Semicon will develop new new solutions using MS 3D ToF sensing technology. LX Semicon has been seeking sensing solutions to be applied to new fields such as home IoT, logistics, and automobiles, with plans to accelerate the development of sensing solutions in cooperation with Microsoft. Microsoft will support LX Semicon with 3D sensing technology and customer-based object recognition service through the cloud platform Azure.
Cyrus Bamji, Hardware Architect Partner, MS Silicon and Sensors Group, said “The collaboration with LX Semicon is meaningful in expanding the semiconductor ecosystem of the Azure Depth platform. By combining LX Semicon's extensive experience with MS' ToF expertise, LX Semicon will provide industrial solutions based on 3D vision and artificial intelligence (AI).”
Jae-duk Lee, Executive Vice President of LX Semicon, stressed, "We will provide customized solutions that can create new future values in various fields through cooperation with Microsoft's cloud-based 3D sensing platform."
By Staff Reporter Dong-jun Kwon / djkwon@etnews.com