Samsung Electro-Mechanics to Develop New Prototype of FoPLP

Nov 25, 2016

Samsung Electro-Mechanics is going to commercialize FoPLP (Fan-out Panel Level Package), which is seen as a dream semiconductor packaging technology, during first half of 2017. FoPLP is a technology that effectively increases I/O (Input/Output) terminals of semiconductors and it can reduce thickness of chips and improve performance and reduce production cost. When this technology is applied to mobile AP (Application Processor), it is possible to develop thinner and faster Smartphones.
“We have developed a new prototype of packaging through FoPLP.” said Director Bae Kwang-wook of Samsung Electro-Mechanics at ‘Semiconductor High-Tech Packaging Technology Conference’, which is arranged by The Electronic Times and Consortium of Semiconductor Advanced Research and was held at Ritz Carlton Hotel on the 24th. “We will be able to start mass-producing these products during first half of 2017.”
“First packaging product will be somewhat of a simple semiconductor chip.” said Director Bae. “Our goal is to mass-produce bigger mobile AP through FoPLP technology in second half of 2017.”
Director Bae announced that if it increases capabilities up to a level that can handle mobile AP, then Samsung Electro-Mechanics is going to invest more into extending mass-production lines during second half of 2017.

‘Semiconductor High-Tech Packaging Technology Conference’, which was arranged by Consortium of Semiconductor Advanced Research and The Electronic Times, was held at Ritz Carlton Hotel on the 24th.  Director Bae Kwang-wook of Samsung Electro-Mechanics is announcing about Samsung’s direction towards development of next-generation PKG technology.  Staff Reporter Kim, Dongwook | gphoto@etnews.com <‘Semiconductor High-Tech Packaging Technology Conference’, which was arranged by Consortium of Semiconductor Advanced Research and The Electronic Times, was held at Ritz Carlton Hotel on the 24th. Director Bae Kwang-wook of Samsung Electro-Mechanics is announcing about Samsung’s direction towards development of next-generation PKG technology. Staff Reporter Kim, Dongwook | gphoto@etnews.com>

Fan-out packaging is a technology that increases number of I/O by taking out I/O terminal wiring outside of silicon chip (die) and it can easily package chips with many I/O. It can also reduce production cost since package PCB (Printed Circuit Board) is not necessary and can reduce thickness of final package. A10, which is an AP for iPhone 7 that was recently released by Apple, is applied with fan-out packaging technology. It is heard that Samsung Electronics and Qualcomm are going to apply fan-out packaging technology to their next APs.
Unlike FoWLP (Fan-out Wafer Level Package) that carries out packaging process on top of a wafer board with diameter of 300mm, Samsung Electro-Mechanics’ FoPLP carries out many processes that are necessary for packaging by placing a chip on top of a panel board with an area of 400x500mm. Because the board is a square shape, amount of parts that are thrown away s less than FoWLP. This indicates that its productivity is high.
Samsung Electro-Mechanics made an announcement in last July that it will be investing $224 million (264 billion KRW) to establish mass-production line for FoPLP.
“Samsung Electro-Mechanics is working with major engineers from Samsung Electronics Semiconductor and Samsung Display to improve level of FoPLP technologies.” said Director Bae. “We are going to make this project a successful one.”
Staff Reporter Han, Juyeop | powerusr@etnews.com

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